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CEVA Licenses Xpert-Teak DSP Platform to Sharp for Portable Multimedia Devices

SAN JOSE, CA -- (MARKET WIRE) -- 16-11-2004 -- CEVA, Inc. (NASDAQ: CEVA) (LSE: CVA), the leading licensor of Digital Signal Processor (DSP) cores and communication solutions to the semiconductor industry, today announced that it has licensed the Xpert-Teak DSP platform to the Integrated Circuits Group of Sharp Corporation, targeting video and rich-media image application processing on Sharp's portable multimedia devices and mobile phones.

Sharp's adoption of CEVA Xpert-Teak exploits the platform's high performance at very low power in multimedia application processing for various SoC designs. In deploying Xpert-Teak across their multimedia product range, Sharp breaks the cycle of investing in a new DSP architecture for each new application, and exploits the cost and time-to-market advantages of reusable DSP platforms.

"Sharp's adoption of our Xpert-Teak DSP platform across the multimedia product line in the semiconductor division is a tremendous endorsement of CEVA," commented Chet Silvestri, President and CEO of CEVA. "For next-generation devices, CEVA's DSP cores enable important partners such as Sharp focus on developing differentiated and leading solutions in a rapid time-to-market."

About CEVA Xpert-Teak

The Xpert-Teak subsystem is a complete, licensable, DSP subsystem for low-power, low-cost, programmable, DSP-based SoC designs targeted at low-power and high-performance applications such as wireless baseband and application processing, digital cameras, consumer and professional audio, VoIP applications and other emerging markets. Built around CEVA's widely adapted dual-MAC CEVA-Teak DSP Core, it is fully synthesizable and process-independent, and can be incorporated into a highly integrated SoC. CEVA Xpert-Teak includes all required hardware peripherals and incorporates on-chip data and program memories, high-performance DMA controller, Buffered Time Division Multiplexing Port (BTDMP), high-throughput Host Processor Interface (HPI), and other interfaces. The subsystem can be used with off-the-shelf software provided by CEVA and its technology partners.

About CEVA, Inc.

Headquartered in San Jose, California, CEVA is the leading licensor of DSP cores and communications solutions to the semiconductor industry. CEVA markets a portfolio of DSP IP in three integrated areas: CEVA DSPs, CEVA System Platforms and CEVA Applications, all supported by CEVA Services. CEVA's technology has been embedded in over 70 million devices year-to-date 2004. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information visit www.ceva-dsp.com

Contacts:
Media inquiries, please contact:

USA
Tara Sims
Eastwick Communications
Tel: 650-480-4031
Email: tara@eastwick.com

Other Regions
Josh Shuman
Ruder Finn
Tel: 212-593-5886
Email: shumanj@ruderfinn.com

CEVA customer, partner and analyst inquiries:
Barry Nolan
CEVA, Inc.
Tel: 408-514-2900


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